Deformation and microstructural evolution of ultrafine- and fine-grained OFHC Cu during dynamic tensile extrusion
The deformation behavior and microstructural evolution of ultrafine- (UFG) and fine-grained (FG) Cu during the dynamic tensile extrusion (DTE) process were investigated. The DTE tests were conducted with identical projectile velocities using an all-vacuum gas gun. The DTE ductility increases as the...
Main Authors: | Keunho Lee, Sanghyun Woo, Seok Bong Kim, Seong Lee, Leeju Park, Kyung-Tae Park |
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Format: | Article |
Language: | English |
Published: |
Elsevier
2020-09-01
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Series: | Journal of Materials Research and Technology |
Subjects: | |
Online Access: | http://www.sciencedirect.com/science/article/pii/S223878542031588X |
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