An Innovative Method to Improve Model Accuracy by Implementing Multi-models Scheme for 28nm Node and Below
As the process comes into 28nm node and below, lithography struggles stronger between high resolution (high NA) and enough process window especially for hole layers (Contacts and Vias). Taking more care of process window may result in lower image quality of structures and bigger uncertainty in OPC m...
| Main Authors: | , , , |
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| Format: | Article |
| Language: | English |
| Published: |
JommPublish
2019-09-01
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| Series: | Journal of Microelectronic Manufacturing |
| Subjects: | |
| Online Access: | http://www.jommpublish.org/p/35/# |