Microstructure Evolution and Hot Deformation Behavior of a CuNiSn Alloy

Microstructure Evolution and Hot Deformation Behavior of a CuNiSn Alloy

The hot deformation behavior of Cu-20.0Ni-5.0Sn-0.25Zn-0.22Mn was investigated using a Gleeble-3500 thermal simulator with a temperature range from 720 °C to 880 °C and a strain rate range from 0.001 s<sup>−1</sup> to 1 s<sup>−1</sup>. The results show that the flow stress in...

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Bibliographic Details
Main Authors:	Yexin Jiang, Xu Wang, Zhou Li, Zhu Xiao, Xiaofei Sheng, Hongyun Jiang, Gengsheng Cai, Xianwei Zhang
Format:	Article
Language:	English
Published:	MDPI AG 2021-03-01
Series:	Processes
Subjects:	microstructure evolution hot deformation behavior CuNiSn alloy
Online Access:	https://www.mdpi.com/2227-9717/9/3/451

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