Improvement on Fully Filled Through Silicon Vias by Optimized Sputtering and Electroplating Conditions

The high reliability of electroplating through silicon vias (TSVs) is an attractive hotspot in the application of high-density integrated circuit packaging. In this paper, improvements for fully filled TSVs by optimizing sputtering and electroplating conditions were introduced. Particular attention...

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Bibliographic Details
Main Author: Fei Zhao
Format: Article
Language:English
Published: MDPI AG 2019-11-01
Series:Materials
Subjects:
Online Access:https://www.mdpi.com/1996-1944/12/22/3713

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