INVESTIGATING THE CORROSION BEHAVIOR OF NANO STRUCTURED COPPER STRIP PRODUCED BY ACCUMULATIVE ROLL BONDING (ARB) PROCESS IN ACIDIC CHLORIDE ENVIRONMENT
In this research accumulative roll bonding process as sever plastic deformation process was applied up to 8 cycles to produce the ultrafine grain copper. Microstructure of cycle 1, cycle 4 and cycle 8 investigated by TEM images. By analyzing TEM images the grain size measured below 100 nm in cycle 8...
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doaj-f97b5fd720474dc785c9be2b83dcbfd22020-11-24T22:28:52ZengIran University of Science & TechnologyIranian Journal of Materials Science and Engineering1735-08082383-38822014-06-011122536INVESTIGATING THE CORROSION BEHAVIOR OF NANO STRUCTURED COPPER STRIP PRODUCED BY ACCUMULATIVE ROLL BONDING (ARB) PROCESS IN ACIDIC CHLORIDE ENVIRONMENTA. Nikfahm0I. Danaee1A. Ashrafi2M. R. Toroghinejad3 Department of Technical Inspection Engineering, Abadan Faculty of Petroleum Engineering, Petroleum University of Technology, Abadan, Iran. Department of Technical Inspection Engineering, Abadan Faculty of Petroleum Engineering, Petroleum University of Technology, Abadan, Iran. Department of Materials Engineering, Faculty of Engineering, Shahid Chamran University, Ahvaz, Iran. Department of Materials Engineering, Isfahan University of Technology, Isfahan, Iran. In this research accumulative roll bonding process as sever plastic deformation process was applied up to 8 cycles to produce the ultrafine grain copper. Microstructure of cycle 1, cycle 4 and cycle 8 investigated by TEM images. By analyzing TEM images the grain size measured below 100 nm in cycle 8 and it was with an average grain size of 200 nm. Corrosion resistance of rolled copper strips in comparing with unrolled copper strip was investigated in acidic (pH=2) 3.5 wt. % NaCl solution. Potentiodynamic polarization and EIS tests used for corrosion resistance investigations. The corrosion morphologies analyzed by FE-SEM microscopy after polarization test and immersion for 40 hours. Results show that the corrosion resistance decreased up to cycle 2 and increased after rolled for forth time. The corrosion degradation was more intergranular in cycle 2 and unrolled counterpart. It was more uniform rather than intergranular type in cycle 8. Corrosion current density in unrolled sample (2.55 µAcm -2 ) was about two times of that in cycle 8 (1.45 µAcm -2 ). The higher corrosion rate in cycle 2 in comparison with others was attributed to unstable microstructure and increase in dislocation density whereas the uniform corrosion in cycle 8 was due to stable UFG formationhttp://ijmse.iust.ac.ir/browse.php?a_code=A-10-127-49&slc_lang=en&sid=1Ultrafine Grain Corrosion Copper NaCl Accumulative Roll Bonding SPD |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
A. Nikfahm I. Danaee A. Ashrafi M. R. Toroghinejad |
spellingShingle |
A. Nikfahm I. Danaee A. Ashrafi M. R. Toroghinejad INVESTIGATING THE CORROSION BEHAVIOR OF NANO STRUCTURED COPPER STRIP PRODUCED BY ACCUMULATIVE ROLL BONDING (ARB) PROCESS IN ACIDIC CHLORIDE ENVIRONMENT Iranian Journal of Materials Science and Engineering Ultrafine Grain Corrosion Copper NaCl Accumulative Roll Bonding SPD |
author_facet |
A. Nikfahm I. Danaee A. Ashrafi M. R. Toroghinejad |
author_sort |
A. Nikfahm |
title |
INVESTIGATING THE CORROSION BEHAVIOR OF NANO STRUCTURED COPPER STRIP PRODUCED BY ACCUMULATIVE ROLL BONDING (ARB) PROCESS IN ACIDIC CHLORIDE ENVIRONMENT |
title_short |
INVESTIGATING THE CORROSION BEHAVIOR OF NANO STRUCTURED COPPER STRIP PRODUCED BY ACCUMULATIVE ROLL BONDING (ARB) PROCESS IN ACIDIC CHLORIDE ENVIRONMENT |
title_full |
INVESTIGATING THE CORROSION BEHAVIOR OF NANO STRUCTURED COPPER STRIP PRODUCED BY ACCUMULATIVE ROLL BONDING (ARB) PROCESS IN ACIDIC CHLORIDE ENVIRONMENT |
title_fullStr |
INVESTIGATING THE CORROSION BEHAVIOR OF NANO STRUCTURED COPPER STRIP PRODUCED BY ACCUMULATIVE ROLL BONDING (ARB) PROCESS IN ACIDIC CHLORIDE ENVIRONMENT |
title_full_unstemmed |
INVESTIGATING THE CORROSION BEHAVIOR OF NANO STRUCTURED COPPER STRIP PRODUCED BY ACCUMULATIVE ROLL BONDING (ARB) PROCESS IN ACIDIC CHLORIDE ENVIRONMENT |
title_sort |
investigating the corrosion behavior of nano structured copper strip produced by accumulative roll bonding (arb) process in acidic chloride environment |
publisher |
Iran University of Science & Technology |
series |
Iranian Journal of Materials Science and Engineering |
issn |
1735-0808 2383-3882 |
publishDate |
2014-06-01 |
description |
In this research accumulative roll bonding process as sever plastic deformation process was applied up to
8 cycles to produce the ultrafine grain copper. Microstructure of cycle 1, cycle 4 and cycle 8 investigated by TEM
images. By analyzing TEM images the grain size measured below 100 nm in cycle 8 and it was with an average grain
size of 200 nm. Corrosion resistance of rolled copper strips in comparing with unrolled copper strip was investigated
in acidic (pH=2) 3.5 wt. % NaCl solution. Potentiodynamic polarization and EIS tests used for corrosion resistance
investigations. The corrosion morphologies analyzed by FE-SEM microscopy after polarization test and immersion for
40 hours. Results show that the corrosion resistance decreased up to cycle 2 and increased after rolled for forth time.
The corrosion degradation was more intergranular in cycle 2 and unrolled counterpart. It was more uniform rather
than intergranular type in cycle 8. Corrosion current density in unrolled sample (2.55 µAcm
-2
) was about two times of
that in cycle 8 (1.45 µAcm
-2
). The higher corrosion rate in cycle 2 in comparison with others was attributed to unstable
microstructure and increase in dislocation density whereas the uniform corrosion in cycle 8 was due to stable UFG
formation |
topic |
Ultrafine Grain Corrosion Copper NaCl Accumulative Roll Bonding SPD |
url |
http://ijmse.iust.ac.ir/browse.php?a_code=A-10-127-49&slc_lang=en&sid=1 |
work_keys_str_mv |
AT anikfahm investigatingthecorrosionbehaviorofnanostructuredcopperstripproducedbyaccumulativerollbondingarbprocessinacidicchlorideenvironment AT idanaee investigatingthecorrosionbehaviorofnanostructuredcopperstripproducedbyaccumulativerollbondingarbprocessinacidicchlorideenvironment AT aashrafi investigatingthecorrosionbehaviorofnanostructuredcopperstripproducedbyaccumulativerollbondingarbprocessinacidicchlorideenvironment AT mrtoroghinejad investigatingthecorrosionbehaviorofnanostructuredcopperstripproducedbyaccumulativerollbondingarbprocessinacidicchlorideenvironment |
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1725745926746669056 |