Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy
We report the influence of growth rate and external magnetic field on the eutectic lamellar spacing and properties of directionally-solidified Ag-Cu eutectic alloys. The results indicated that the relationship between the lamellar spacing of directionally-solidified Ag-Cu alloys and the growth rate...
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doaj-ff5c09781e1349949e7789537dc255672020-11-24T22:39:31ZengMDPI AGMaterials1996-19442016-07-019756910.3390/ma9070569ma9070569Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic AlloyXiaowei Zuo0Congcong Zhao1Lin Zhang2Engang Wang3Key Laboratory of Electromagnetic Processing of Materials (Ministry of Education), Northeastern University, Shenyang 110004, ChinaKey Laboratory of Electromagnetic Processing of Materials (Ministry of Education), Northeastern University, Shenyang 110004, ChinaKey Laboratory of Electromagnetic Processing of Materials (Ministry of Education), Northeastern University, Shenyang 110004, ChinaKey Laboratory of Electromagnetic Processing of Materials (Ministry of Education), Northeastern University, Shenyang 110004, ChinaWe report the influence of growth rate and external magnetic field on the eutectic lamellar spacing and properties of directionally-solidified Ag-Cu eutectic alloys. The results indicated that the relationship between the lamellar spacing of directionally-solidified Ag-Cu alloys and the growth rate matched the prediction of the Jackson-Hunt model, and the constant was 5.8 µm3/s. The increasing external magnetic field during solidification tilted the growth direction of the lamellar eutectics, and coarsened the eutectic lamellar spacing. These decreased the microhardness and strength of Ag-Cu alloys, but increased their electrical conductivity. The competitive strengthening contributions between the refinement of the eutectic lamellar spacing and the change in growth direction of the eutectics resulted in higher strength in the as-rolled sample with a 0.8 T magnetic field than with other samples, which was confirmed from higher relieved deformation energy using differential scanning calorimetry.http://www.mdpi.com/1996-1944/9/7/569Ag-Cu eutectic alloymagnetic fieldgrowth rateeutectic lamellar spacingmicrohardnessstrength |
collection |
DOAJ |
language |
English |
format |
Article |
sources |
DOAJ |
author |
Xiaowei Zuo Congcong Zhao Lin Zhang Engang Wang |
spellingShingle |
Xiaowei Zuo Congcong Zhao Lin Zhang Engang Wang Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy Materials Ag-Cu eutectic alloy magnetic field growth rate eutectic lamellar spacing microhardness strength |
author_facet |
Xiaowei Zuo Congcong Zhao Lin Zhang Engang Wang |
author_sort |
Xiaowei Zuo |
title |
Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy |
title_short |
Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy |
title_full |
Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy |
title_fullStr |
Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy |
title_full_unstemmed |
Influence of Growth Rate and Magnetic Field on Microstructure and Properties of Directionally Solidified Ag-Cu Eutectic Alloy |
title_sort |
influence of growth rate and magnetic field on microstructure and properties of directionally solidified ag-cu eutectic alloy |
publisher |
MDPI AG |
series |
Materials |
issn |
1996-1944 |
publishDate |
2016-07-01 |
description |
We report the influence of growth rate and external magnetic field on the eutectic lamellar spacing and properties of directionally-solidified Ag-Cu eutectic alloys. The results indicated that the relationship between the lamellar spacing of directionally-solidified Ag-Cu alloys and the growth rate matched the prediction of the Jackson-Hunt model, and the constant was 5.8 µm3/s. The increasing external magnetic field during solidification tilted the growth direction of the lamellar eutectics, and coarsened the eutectic lamellar spacing. These decreased the microhardness and strength of Ag-Cu alloys, but increased their electrical conductivity. The competitive strengthening contributions between the refinement of the eutectic lamellar spacing and the change in growth direction of the eutectics resulted in higher strength in the as-rolled sample with a 0.8 T magnetic field than with other samples, which was confirmed from higher relieved deformation energy using differential scanning calorimetry. |
topic |
Ag-Cu eutectic alloy magnetic field growth rate eutectic lamellar spacing microhardness strength |
url |
http://www.mdpi.com/1996-1944/9/7/569 |
work_keys_str_mv |
AT xiaoweizuo influenceofgrowthrateandmagneticfieldonmicrostructureandpropertiesofdirectionallysolidifiedagcueutecticalloy AT congcongzhao influenceofgrowthrateandmagneticfieldonmicrostructureandpropertiesofdirectionallysolidifiedagcueutecticalloy AT linzhang influenceofgrowthrateandmagneticfieldonmicrostructureandpropertiesofdirectionallysolidifiedagcueutecticalloy AT engangwang influenceofgrowthrateandmagneticfieldonmicrostructureandpropertiesofdirectionallysolidifiedagcueutecticalloy |
_version_ |
1725708521896411136 |