Pad Scratching in Chemical-Mechanical Polishing: The Effects of Mechanical and Tribological Properties
In chemical-mechanical polishing (CMP), even the soft pad asperities may, under certain conditions, generate scratches on the relatively hard surfaces being polished. In the present study, contact mechanics models of pad-induced scratching are formulated, and the effects of the hardness of the surfa...
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Format: | Article |
Language: | English |
Published: |
Electrochemical Society,
2017-04-11T19:13:09Z.
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Subjects: | |
Online Access: | Get fulltext |