Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips

© 2019 IEEE High power densities lead to thermal hot spots in modern processors. These power densities are expected to reach kW/cm2 scale in future high-performance chips and this increase may significantly degrade performance and reliability, if not handled efficiently. Using two-phase vapor chambe...

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Bibliographic Details
Main Authors: Yuan, Zihao (Author), Vaartstra, Geoffrey (Author), Shukla, Prachi (Author), Said, Mostafa (Author), Reda, Sherief (Author), Wang, Evelyn (Author), Coskun, Ayse K. (Author)
Format: Article
Language:English
Published: IEEE, 2021-11-09T14:49:23Z.
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