Two-Phase Vapor Chambers with Micropillar Evaporators: A New Approach to Remove Heat from Future High-Performance Chips
© 2019 IEEE High power densities lead to thermal hot spots in modern processors. These power densities are expected to reach kW/cm2 scale in future high-performance chips and this increase may significantly degrade performance and reliability, if not handled efficiently. Using two-phase vapor chambe...
| Main Authors: | , , , , , , |
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| Format: | Article |
| Language: | English |
| Published: |
IEEE,
2021-11-09T14:49:23Z.
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| Subjects: | |
| Online Access: | Get fulltext |