A 4Gb/s/ch 356fJ/b 10mm equalized on-chip interconnect with nonlinear charge-injecting transmit filter and transimpedance receiver in 90nm CMOS

This paper presents a transceiver for fast and energy-efficient global on-chip communication, consisting of a nonlinear charge-injecting (CI) 3-tap transmit filter (TX) and a sampling receiver (RX) with transimpedance pre-amplifier (TIA). Recently, pre-emphasis techniques have demonstrated significa...

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Bibliographic Details
Main Authors: Stojanovic, Vladimir Marko (Contributor), Kim, Byungsub (Contributor)
Other Authors: Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science (Contributor)
Format: Article
Language:English
Published: Institute of Electrical and Electronics Engineers, 2010-10-21T20:44:52Z.
Subjects:
Online Access:Get fulltext
LEADER 02224 am a22002533u 4500
001 59456
042 |a dc 
100 1 0 |a Stojanovic, Vladimir Marko  |e author 
100 1 0 |a Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science  |e contributor 
100 1 0 |a Stojanovic, Vladimir Marko  |e contributor 
100 1 0 |a Stojanovic, Vladimir Marko  |e contributor 
100 1 0 |a Kim, Byungsub  |e contributor 
700 1 0 |a Kim, Byungsub  |e author 
245 0 0 |a A 4Gb/s/ch 356fJ/b 10mm equalized on-chip interconnect with nonlinear charge-injecting transmit filter and transimpedance receiver in 90nm CMOS 
260 |b Institute of Electrical and Electronics Engineers,   |c 2010-10-21T20:44:52Z. 
856 |z Get fulltext  |u http://hdl.handle.net/1721.1/59456 
520 |a This paper presents a transceiver for fast and energy-efficient global on-chip communication, consisting of a nonlinear charge-injecting (CI) 3-tap transmit filter (TX) and a sampling receiver (RX) with transimpedance pre-amplifier (TIA). Recently, pre-emphasis techniques have demonstrated significantly better energy-efficiency than repeater interconnects. To further improve energy-efficiency over pre-emphasis techniques that require analog subtraction, our TX selects a pattern-dependent current to inject into the wire, performing feed-forward equalization (FFE) while mitigating the nonlinearity of the driver. This 3-tap charge-injecting (CI) FFE enables stronger equalization than the capacitively driven TX or edge-detection pre-emphasis, achieving data-rate of 4 Gb/s over a 1 cm on-chip wire. The TIA at RX improves bandwidth, signal amplitude, and reduces bias power, breaking the trade-offs in conventional resistor termination, and mitigates equalized signal degradation due to impedance changes in dynamic current sensing. 
520 |a Massachusetts Institute of Technology. Center for Integrated Circuits and Systems 
520 |a Intel Corporation 
520 |a Semiconductor Research Corporation 
520 |a National Semiconductor Corporation. Trusted Foundry Services 
546 |a en_US 
655 7 |a Article 
773 |t IEEE International Solid-State Circuits Conference - Digest of Technical Papers, 2009. ISSCC 2009