Skip to content
Open Access
  • Home
  • Collections
    • High Impact Articles
    • Jawi Collection
    • Malay Medicine
    • Forensic
  • Search Options
    • UiTM Open Access
    • Search by UiTM Scopus
    • Advanced Search
    • Search by Category
  • Discovery Service
    • Sources
    • UiTM Journals
    • List UiTM Journal in IR
    • Statistic
  • About
    • Open Access
    • Creative Commons Licenses
    • COKI | Malaysia Open Access
    • User Guide
    • Contact Us
    • Search Tips
    • FAQs
Advanced
  • Search
  • Phenomenological modeling of t...
  • Cite this
  • Text this
  • Email this
  • Print
  • Export Record
    • Export to RefWorks
    • Export to EndNoteWeb
    • Export to EndNote
  • Permanent link
Phenomenological modeling of the deformation behavior of solders

Phenomenological modeling of the deformation behavior of solders

Bibliographic Details
Main Author: Scott, Daniel T.
Published: Georgia Institute of Technology 2007
Subjects:
Solder and soldering
Deformations (Mechanics)
Online Access:http://hdl.handle.net/1853/17889
  • Holdings
  • Description
  • Similar Items
  • Staff View

Internet

http://hdl.handle.net/1853/17889

Similar Items

  • Thermal cycling and rate-dependent stress relaxation behavior of solders
    by: Woodmansee, Michael W.
    Published: (2007)
  • A Study of the Processing Properties of Hard-Particle Reinforced Composite Solders
    by: Calderon, Jose Guadalupe
    Published: (1994)
  • PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS
    by: A. A. CHULARIS, et al.
    Published: (2018-07-01)
  • PHYSICAL ASPECTS OF LOW TEMPERATURE SOLDERING WITH GA-SOLDERS
    by: A. A. CHULARIS, et al.
    Published: (2010-04-01)
  • Soldering of Passive Components Using Sn Nanoparticle Reinforced Solder Paste: Influence on Microstructure and Joint Strength
    by: Anas M. Atieh, et al.
    Published: (2019-10-01)

© 2020 | Services hosted by the Perpustakaan Tun Abdul Razak, | Universiti Teknologi MARA | Disclaimer


Loading...