In-process stress analysis of flip chip assemblies during underfill cure and environmental stress testing

In-process stress analysis of flip chip assemblies during underfill cure and environmental stress testing

Bibliographic Details
Main Author:	Palaniappan, Prema
Published:	Georgia Institute of Technology 2008
Subjects:	Electronic packaging Testing Electronic packaging Reliability Strains and stresses
Online Access:	http://hdl.handle.net/1853/19138

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