Analytical and experimental analysis of heat transfer from current microelectronics package designs

Analytical and experimental analysis of heat transfer from current microelectronics package designs

Bibliographic Details
Main Author:	Ray, Atris A., III
Published:	Georgia Institute of Technology 2008
Subjects:	Microelectronic packaging Heat Transmission Electronic apparatus and appliances Cooling Materials Thermal properties
Online Access:	http://hdl.handle.net/1853/19147

Similar Items

Flip chip on flex for low cost electronics assembly
by: Venton, Jennifer Lynne
Published: (2007)

Experimental and theoretical thermal analysis of microelectronic devices
by: Heng, Stephen Fook-Geow
Published: (2007)

Establishment of an analytical and experimental test facility for the evaluation of thermal management in microelectric packages
by: Campbell, James Stephen, Jr.
Published: (2008)

Enhanced thermal conductivity of liquid encapsulants for electronic packaging
by: Bollampally, Raja Sheker
Published: (2008)

Thermal management of three-dimensional integrated circuits using inter-layer liquid cooling
by: King, Calvin R., Jr.
Published: (2012)

The development of a Heat Transfer Module (HTM) for the thermal management of sealed electronic enclosures
by: Minichiello, Angela
Published: (2007)

Computational and experimental investigations of laser drilling and welding for microelectronic packaging
by: Han, Wei
Published: (2004)

Carbon nanotubes for thermal interface materials in microelectronic packaging
by: Lin, Wei
Published: (2013)

Experimental and theoretical assessment of thin glass panels as interposers for microelectronic packages
by: McCann, Scott R.
Published: (2014)

Stacked Microchannel Heat Sinks for Liquid Cooling of Microelectronics Devices
by: Wei, Xiaojin
Published: (2005)

Thermo-Mechanical Selective Laser Assisted Die Transfer
by: Miller, Ross Alan
Published: (2019)

Helix-type compliant off-chip interconnect for microelectronic packaging
by: Zhu, Qi
Published: (2007)

Experimental and theoretical assessment of Through-Silicon Vias for 3D integrated microelectronic packages
by: Liu, Xi
Published: (2014)

Optimization of thermoelectric cooling by the use of cascades
by: Cowling, Peter Warning
Published: (2007)

Structural thermal-electric modeling and analysis of micro-springs for microelectronic probing and packaging applications
by: Ahmad, Mudasir
Published: (2008)

An integrated process modeling methodology and module for sequential multilayered high-density substrate fabrication for microelectronic packages
by: Dunne, Rajiv Carl
Published: (2007)

Experimental temperature measurements of microelectronic computer boards using an infrared camera
by: Krempel, Louis A.
Published: (2007)

Analysis of vertical channel flow and heat transfer using the finite-element method
by: Hawkins, L. E.
Published: (2014)

High throughput flip chip assembly process application and assessment using no-flow underfill materials
by: Milner, David William
Published: (2007)

Imprint lithography and characterization of photosensitive polymers for advanced microelectronics packaging
by: Rajarathinam, Venmathy
Published: (2010)

Methodology for predicting microelectronic substrate warpage incorporating copper trace pattern characteristics
by: McCaslin, Luke
Published: (2008)

Cohesive zone modeling for predicting interfacial delamination in microelectronic packaging
by: Krieger, William E. R.
Published: (2014)

Thermochemical modeling of composite materials for base substrate applications in microelectronic systems
by: Bassett, Julien
Published: (2007)

Experimental and analytical research of the heat transfer process in the package of perforated plates
by: Živković Predrag M., et al.
Published: (2016-01-01)

Stress Analysis for Chip Scale Packages with Embedded Active Devices under Thermal Cycling
by: Yeo, Hyunwook
Published: (2014)

Morphology Evaluation of Microelectronic Packaging Substrates Using Shadow Moiré Technique
by: Fulong Zhu, et al.
Published: (2018-01-01)

Thermo-mechanical evaluation of interfacial integrity in multilayered microelectronic packages
by: Xie, Weidong
Published: (2007)

On the heat transfer characteristics of spray cooling
by: Halvorson, Peter Joseph
Published: (2007)

Impingement heat transfer on a rotating cylinder : an experimental study of calender cooling
by: Pelletier, Lorraine.
Published: (1984)

Flip chip assembly process development, process characterization, and reliability assessment of polymer stud grid array-chip scaled package
by: Paydenkar, Chetan S.
Published: (2008)

Thermal analysis of power hybrid microelectronic packages
by: Hussein, Mohamad M.
Published: (2014)

Palletization and design-of-simulations for large area processing and assembly in electronic packaging
by: Variyam, Manjula N.
Published: (2007)

EXPERIMENTAL STUDY OF HEAT TRANSFER OF A SINGLE-ROW BUNDLE OF FINNED TUBES IN MIXED CONVECTION OF AIR
by: A. B. Sukhotskii, et al.
Published: (2017-07-01)

Local heat transfer rate and bubble dynamics during jet impingement boiling
by: Mani, Preeti
Published: (2012)

Accurate, high speed predictive modeling of passive devices
by: Poddar, Ravi
Published: (2007)

A thermal analysis tool for three-dimensional models of multilayer microelectronics
by: Creel, Kenneth E.
Published: (2014)

Heat transfer resulting from the evaporation of liquid droplets on a horizontal heated surface
by: Sellers, Sally M.
Published: (2007)

Model extraction of a paddle in plastic surface-mount RF-IC packages
by: Sundberg, Garth
Published: (2012)

Study of warpage of base substrates and materials for large-area MCM-D packaging
by: Dang, Anh Xuan-Hung
Published: (2007)

Performance and flow stability characteristics in two-phase confined impinging jets
by: Sabo, Michael D.
Published: (2012)