Design-for-manufacturability (DFM) for system-in-package (SiP) applications
Microelectronic systems packaging involves layout dimensions of the order of microns. During manufacturing, process variations will cause parameters to deviate from their nominal values. As a result, the manufactured circuit may no longer meet the specifications it is designed to satisfy. When produ...
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Georgia Institute of Technology
2009
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| Online Access: | http://hdl.handle.net/1853/26701 |