Increase the packing density of vertically aligned carbon nanotube array for the application of thermal interface materials

Increase the packing density of vertically aligned carbon nanotube array for the application of thermal interface materials

To fulfill the potential of carbon nanotube (CNT) as thermal interface material (TIM), the packing density of CNT array needs improvement. In this work, two potential ways to increase the packing density of CNT array are tested. They are liquid precursor(LP)CVD and cycled catalyst deposition method....

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Bibliographic Details
Main Author: Gu, Wentian
Published: Georgia Institute of Technology 2011
Subjects:
Chemical vapor deposition
Carbon nanotube
Thermal transport
Nanotubes
Carbon
Thermal interface materials
Online Access:http://hdl.handle.net/1853/41049
id ndltd-GATECH-oai-smartech.gatech.edu-1853-41049
record_format oai_dc
spelling ndltd-GATECH-oai-smartech.gatech.edu-1853-410492013-01-07T20:37:38ZIncrease the packing density of vertically aligned carbon nanotube array for the application of thermal interface materialsGu, WentianChemical vapor depositionCarbon nanotubeThermal transportNanotubesCarbonThermal interface materialsTo fulfill the potential of carbon nanotube (CNT) as thermal interface material (TIM), the packing density of CNT array needs improvement. In this work, two potential ways to increase the packing density of CNT array are tested. They are liquid precursor(LP)CVD and cycled catalyst deposition method. Although LP-CVD turned out to be no help for packing density increase, it is proved to enhance the CNT growth rate. The packing density of CNT array indeed increases with the cycle number. The thermal conductivity of the CNT array increases with the packing density. This work is believed to be a step closer to the real life application of CNT in electronic packaging industry.Georgia Institute of Technology2011-09-22T17:45:16Z2011-09-22T17:45:16Z2011-03-23Thesishttp://hdl.handle.net/1853/41049
collection NDLTD
sources NDLTD
topic Chemical vapor deposition
Carbon nanotube
Thermal transport
Nanotubes
Carbon
Thermal interface materials
spellingShingle Chemical vapor deposition
Carbon nanotube
Thermal transport
Nanotubes
Carbon
Thermal interface materials
Gu, Wentian
Increase the packing density of vertically aligned carbon nanotube array for the application of thermal interface materials
description To fulfill the potential of carbon nanotube (CNT) as thermal interface material (TIM), the packing density of CNT array needs improvement. In this work, two potential ways to increase the packing density of CNT array are tested. They are liquid precursor(LP)CVD and cycled catalyst deposition method. Although LP-CVD turned out to be no help for packing density increase, it is proved to enhance the CNT growth rate. The packing density of CNT array indeed increases with the cycle number. The thermal conductivity of the CNT array increases with the packing density. This work is believed to be a step closer to the real life application of CNT in electronic packaging industry.
author Gu, Wentian
author_facet Gu, Wentian
author_sort Gu, Wentian
title Increase the packing density of vertically aligned carbon nanotube array for the application of thermal interface materials
title_short Increase the packing density of vertically aligned carbon nanotube array for the application of thermal interface materials
title_full Increase the packing density of vertically aligned carbon nanotube array for the application of thermal interface materials
title_fullStr Increase the packing density of vertically aligned carbon nanotube array for the application of thermal interface materials
title_full_unstemmed Increase the packing density of vertically aligned carbon nanotube array for the application of thermal interface materials
title_sort increase the packing density of vertically aligned carbon nanotube array for the application of thermal interface materials
publisher Georgia Institute of Technology
publishDate 2011
url http://hdl.handle.net/1853/41049
work_keys_str_mv AT guwentian increasethepackingdensityofverticallyalignedcarbonnanotubearrayfortheapplicationofthermalinterfacematerials
_version_ 1716475535397224448

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