Carbon nanotubes for thermal interface materials in microelectronic packaging
As the integration scale of transistors/devices in a chip/system keeps increasing, effective cooling has become more and more important in microelectronics. To address the thermal dissipation issue, one important solution is to develop thermal interface materials with higher performance. Carbon nano...
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Georgia Institute of Technology
2013
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| Online Access: | http://hdl.handle.net/1853/45929 |