Menezes, G., & Tummala, R. R. (2014). Modeling, design, fabrication and characterization of glass package-to-PCB interconnections. Georgia Institute of Technology.
Chicago Style (17th ed.) CitationMenezes, Gary, and Rao R. Tummala. Modeling, Design, Fabrication and Characterization of Glass Package-to-PCB Interconnections. Georgia Institute of Technology, 2014.
MLA (8th ed.) CitationMenezes, Gary, and Rao R. Tummala. Modeling, Design, Fabrication and Characterization of Glass Package-to-PCB Interconnections. Georgia Institute of Technology, 2014.
Warning: These citations may not always be 100% accurate.