Transient Joule heating in nano-scale embedded on-chip interconnects
Major challenges in maintaining quality and reliability in today’s microelectronics devices come from the ever increasing level of integration in the device fabrication, as well as the high level of current densities that are carried through the microchip during operation. In order to have a framewo...
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| Format: | Others |
| Language: | en_US |
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Georgia Institute of Technology
2014
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| Online Access: | http://hdl.handle.net/1853/51786 |