Architecting heterogeneous memory systems with 3D die-stacked memory
The main objective of this research is to efficiently enable 3D die-stacked memory and heterogeneous memory systems. 3D die-stacking is an emerging technology that allows for large amounts of in-package high-bandwidth memory storage. Die-stacked memory has the potential to provide extraordinary perf...
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Format: | Others |
Language: | en_US |
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Georgia Institute of Technology
2015
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Online Access: | http://hdl.handle.net/1853/53835 |