Architecting heterogeneous memory systems with 3D die-stacked memory

The main objective of this research is to efficiently enable 3D die-stacked memory and heterogeneous memory systems. 3D die-stacking is an emerging technology that allows for large amounts of in-package high-bandwidth memory storage. Die-stacked memory has the potential to provide extraordinary perf...

Full description

Bibliographic Details
Main Author: Sim, Jae Woong
Other Authors: Kim, Hyesoon
Format: Others
Language:en_US
Published: Georgia Institute of Technology 2015
Subjects:
Online Access:http://hdl.handle.net/1853/53835