Effects of Ultrasound in Microelectronic Ultrasonic Wire Bonding
Ultrasonic wire bonding is the most utilized technique in forming electrical interconnections in microelectronics. However, there is a lacking in the fundamental understanding of the process. In order for there to be improvements in the process a better understanding of the process is required. T...
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| Language: | en |
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2007
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| Online Access: | http://hdl.handle.net/10012/3439 |
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