Active heat transfer enhancement in integrated fan heat sinks

Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012. === This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections. === Cataloged from PDF version of thesis. === Includes...

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Main Author: Staats, Wayne Lawrence
Other Authors: J.G. Brisson.
Format: Others
Language:English
Published: Massachusetts Institute of Technology 2013
Subjects:
Online Access:http://hdl.handle.net/1721.1/78179
http://hdl.handle.net/1721.1/80414
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spelling ndltd-MIT-oai-dspace.mit.edu-1721.1-804142019-05-02T15:49:48Z Active heat transfer enhancement in integrated fan heat sinks Staats, Wayne Lawrence J.G. Brisson. Massachusetts Institute of Technology. Department of Mechanical Engineering. Massachusetts Institute of Technology. Department of Mechanical Engineering. Mechanical Engineering. Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012. This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections. Cataloged from PDF version of thesis. Includes bibliographical references (p. 205-211). Modern computer processors require significant cooling to achieve their full performance. The "efficiency" of heat sinks is also becoming more important: cooling of electronics consumes 1% of worldwide electricity use by some estimates. Unfortunately, current cooling technologies often focus on improving heat transfer at the expense of efficiency. The present work focuses on a unique, compact, and efficient air cooled heat sink which addresses these shortcomings. While conventional air cooled heat sinks typically use a separate fan to force air flow over heated fins, the new design incorporates centrifugal fans directly into the body of a loop heat pipe with multiple planar condensers. These "integrated fans" rotate between the planar condensers, in close proximity to the hot surfaces, establishing a radially outward flow of cooling air. The proximity of the rotating impellers to the condenser surfaces results in a marked enhancement in the convective heat transfer coefficient without a large increase in input power. To develop an understanding of the heat transfer in integrated fan heat sinks, a series of experiments was performed to simultaneously characterize the fan performance and average heat transfer coefficients. These characterizations were performed for 15 different impeller profiles with various impeller-to-gap thickness ratios. The local heat transfer coefficient was also measured using a new heated-thin-film infrared thermography technique capable of applying various thermal boundary conditions. The heat transfer was found to be a function of the flow and rotational Reynolds numbers, and the results suggest that turbulent flow structures introduced by the fans govern the transport of thermal energy in the air. The insensitivity of the heat transfer to the impeller profile decouples the fan design from the convection enhancement problem, greatly simplifying the heat sink design process. Based on the experimental results, heat transfer and fan performance correlations were developed (most notably, a two-parameter correlation that predicts the dimensionless heat transfer coefficients across 98% of the experimental work to within 20% relative RMS error). Finally, models were developed to describe the scaling of the heat transfer and mechanical power consumption in multi-fan heat sinks. These models were assessed against experimental results from two prototypes, and suggest that future integrated fan heat sink designs can achieve a 4x reduction in thermal resistance and 3x increase in coefficient of performance compared to current state-of-the-art air cooled heat sinks. by Wayne L. Staats, Jr. Ph.D. 2013-09-12T18:03:12Z 2013-09-12T18:03:12Z 2012 2012 Thesis http://hdl.handle.net/1721.1/78179 http://hdl.handle.net/1721.1/80414 829793532 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 211 p. application/pdf Massachusetts Institute of Technology
collection NDLTD
language English
format Others
sources NDLTD
topic Mechanical Engineering.
spellingShingle Mechanical Engineering.
Staats, Wayne Lawrence
Active heat transfer enhancement in integrated fan heat sinks
description Thesis (Ph. D.)--Massachusetts Institute of Technology, Dept. of Mechanical Engineering, 2012. === This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections. === Cataloged from PDF version of thesis. === Includes bibliographical references (p. 205-211). === Modern computer processors require significant cooling to achieve their full performance. The "efficiency" of heat sinks is also becoming more important: cooling of electronics consumes 1% of worldwide electricity use by some estimates. Unfortunately, current cooling technologies often focus on improving heat transfer at the expense of efficiency. The present work focuses on a unique, compact, and efficient air cooled heat sink which addresses these shortcomings. While conventional air cooled heat sinks typically use a separate fan to force air flow over heated fins, the new design incorporates centrifugal fans directly into the body of a loop heat pipe with multiple planar condensers. These "integrated fans" rotate between the planar condensers, in close proximity to the hot surfaces, establishing a radially outward flow of cooling air. The proximity of the rotating impellers to the condenser surfaces results in a marked enhancement in the convective heat transfer coefficient without a large increase in input power. To develop an understanding of the heat transfer in integrated fan heat sinks, a series of experiments was performed to simultaneously characterize the fan performance and average heat transfer coefficients. These characterizations were performed for 15 different impeller profiles with various impeller-to-gap thickness ratios. The local heat transfer coefficient was also measured using a new heated-thin-film infrared thermography technique capable of applying various thermal boundary conditions. The heat transfer was found to be a function of the flow and rotational Reynolds numbers, and the results suggest that turbulent flow structures introduced by the fans govern the transport of thermal energy in the air. The insensitivity of the heat transfer to the impeller profile decouples the fan design from the convection enhancement problem, greatly simplifying the heat sink design process. Based on the experimental results, heat transfer and fan performance correlations were developed (most notably, a two-parameter correlation that predicts the dimensionless heat transfer coefficients across 98% of the experimental work to within 20% relative RMS error). Finally, models were developed to describe the scaling of the heat transfer and mechanical power consumption in multi-fan heat sinks. These models were assessed against experimental results from two prototypes, and suggest that future integrated fan heat sink designs can achieve a 4x reduction in thermal resistance and 3x increase in coefficient of performance compared to current state-of-the-art air cooled heat sinks. === by Wayne L. Staats, Jr. === Ph.D.
author2 J.G. Brisson.
author_facet J.G. Brisson.
Staats, Wayne Lawrence
author Staats, Wayne Lawrence
author_sort Staats, Wayne Lawrence
title Active heat transfer enhancement in integrated fan heat sinks
title_short Active heat transfer enhancement in integrated fan heat sinks
title_full Active heat transfer enhancement in integrated fan heat sinks
title_fullStr Active heat transfer enhancement in integrated fan heat sinks
title_full_unstemmed Active heat transfer enhancement in integrated fan heat sinks
title_sort active heat transfer enhancement in integrated fan heat sinks
publisher Massachusetts Institute of Technology
publishDate 2013
url http://hdl.handle.net/1721.1/78179
http://hdl.handle.net/1721.1/80414
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