Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1999. === Includes bibliographical references (leaves 103-108). === by V.T. Srikar. === Ph.D.
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ndltd-MIT-oai-dspace.mit.edu-1721.1-852492019-05-02T16:11:50Z Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits Srikar, V. T. (Vengallatore Thattai), 1972- Carl V. Thompson. Massachusetts Institute of Technology. Department of Materials Science and Engineering Materials Science and Engineering Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1999. Includes bibliographical references (leaves 103-108). by V.T. Srikar. Ph.D. 2014-03-06T15:27:55Z 2014-03-06T15:27:55Z 1999 1999 Thesis http://hdl.handle.net/1721.1/85249 42620931 eng M.I.T. theses are protected by copyright. They may be viewed from this source for any purpose, but reproduction or distribution in any format is prohibited without written permission. See provided URL for inquiries about permission. http://dspace.mit.edu/handle/1721.1/7582 108 leaves application/pdf Massachusetts Institute of Technology |
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English |
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Materials Science and Engineering |
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Materials Science and Engineering Srikar, V. T. (Vengallatore Thattai), 1972- Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits |
description |
Thesis (Ph.D.)--Massachusetts Institute of Technology, Dept. of Materials Science and Engineering, 1999. === Includes bibliographical references (leaves 103-108). === by V.T. Srikar. === Ph.D. |
author2 |
Carl V. Thompson. |
author_facet |
Carl V. Thompson. Srikar, V. T. (Vengallatore Thattai), 1972- |
author |
Srikar, V. T. (Vengallatore Thattai), 1972- |
author_sort |
Srikar, V. T. (Vengallatore Thattai), 1972- |
title |
Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits |
title_short |
Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits |
title_full |
Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits |
title_fullStr |
Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits |
title_full_unstemmed |
Electromigration behavior and reliability of bamboo Al(Cu) interconnects for integrated circuits |
title_sort |
electromigration behavior and reliability of bamboo al(cu) interconnects for integrated circuits |
publisher |
Massachusetts Institute of Technology |
publishDate |
2014 |
url |
http://hdl.handle.net/1721.1/85249 |
work_keys_str_mv |
AT srikarvtvengallatorethattai1972 electromigrationbehaviorandreliabilityofbambooalcuinterconnectsforintegratedcircuits |
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1719036580415406080 |