Conductive Anodic Filament (CAF) Formation

Conductive anodic filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and high voltage gradient conditions. The filament, a copper salt, grows from anode to cathode along the epoxy-glass interface. Ready and Turbini (2000) identified this copper salt a...

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Main Author: Caputo, Antonio
Other Authors: Perovic, Doug
Language:en_ca
Published: 2010
Subjects:
Online Access:http://hdl.handle.net/1807/32038
id ndltd-TORONTO-oai-tspace.library.utoronto.ca-1807-32038
record_format oai_dc
spelling ndltd-TORONTO-oai-tspace.library.utoronto.ca-1807-320382013-04-19T19:55:19ZConductive Anodic Filament (CAF) FormationCaputo, Antoniosolder fluxprinted wiring boardsconductive anodic filament0794Conductive anodic filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and high voltage gradient conditions. The filament, a copper salt, grows from anode to cathode along the epoxy-glass interface. Ready and Turbini (2000) identified this copper salt as the Cu2(OH)3Cl, atacamite compound. This work has investigated the influence of polyethylene glycol (PEG) and polyethylene propylene glycol (PEPG) fluxing agents on the chemical nature of CAF. For coupons processed with PEPG flux, with and without chloride, a copper-chloride containing compound was formed in the polymer matrix. This compound was characterized using x-ray photoelectron spectroscopy (XPS) as CuCl and an electrochemical mechanism for the formation of the chloride-containing CAF has been proposed. For PEG flux, with and without chloride, it has been shown that CAF only formed, but no copper containing compound formed in the matrix. It appears for PEG fluxed coupons, a PEG-Cu-Cl complex forms, binds the available Cu and acts as a barrier to the formation of CuCl in the polymer matrix. Meeker and Lu Valle (1995) have previously proposed that CAF failure is best represented by two competing reactions – the formation of a copper chloride corrosion compound (now identified as Cu2(OH)3Cl) and the formation of innocuous trapped chlorine compounds. Since no evidence of any trapped chloride compounds has been found, we propose that the formation of CAF is best represented by a single non-reversible reaction. For coupons processed with a high bromide-containing flux, bromide containing CAF was created and characterized using transmission electron microscopy (TEM) to be Cu2(OH)3Br. In addition, a copper-containing compound was formed in the polymer matrix and characterized using XPS as CuBr. An electrochemical mechanism for the formation of bromide-containing CAF has been proposed based on the XPS data. .Perovic, DougTurbini, Laura2010-112012-01-18T16:08:09ZWITHHELD_ONE_YEAR2012-01-18T16:08:09Z2012-01-18Thesishttp://hdl.handle.net/1807/32038en_ca
collection NDLTD
language en_ca
sources NDLTD
topic solder flux
printed wiring boards
conductive anodic filament
0794
spellingShingle solder flux
printed wiring boards
conductive anodic filament
0794
Caputo, Antonio
Conductive Anodic Filament (CAF) Formation
description Conductive anodic filament (CAF) is a failure mode in printed wiring boards (PWBs) which occurs under high humidity and high voltage gradient conditions. The filament, a copper salt, grows from anode to cathode along the epoxy-glass interface. Ready and Turbini (2000) identified this copper salt as the Cu2(OH)3Cl, atacamite compound. This work has investigated the influence of polyethylene glycol (PEG) and polyethylene propylene glycol (PEPG) fluxing agents on the chemical nature of CAF. For coupons processed with PEPG flux, with and without chloride, a copper-chloride containing compound was formed in the polymer matrix. This compound was characterized using x-ray photoelectron spectroscopy (XPS) as CuCl and an electrochemical mechanism for the formation of the chloride-containing CAF has been proposed. For PEG flux, with and without chloride, it has been shown that CAF only formed, but no copper containing compound formed in the matrix. It appears for PEG fluxed coupons, a PEG-Cu-Cl complex forms, binds the available Cu and acts as a barrier to the formation of CuCl in the polymer matrix. Meeker and Lu Valle (1995) have previously proposed that CAF failure is best represented by two competing reactions – the formation of a copper chloride corrosion compound (now identified as Cu2(OH)3Cl) and the formation of innocuous trapped chlorine compounds. Since no evidence of any trapped chloride compounds has been found, we propose that the formation of CAF is best represented by a single non-reversible reaction. For coupons processed with a high bromide-containing flux, bromide containing CAF was created and characterized using transmission electron microscopy (TEM) to be Cu2(OH)3Br. In addition, a copper-containing compound was formed in the polymer matrix and characterized using XPS as CuBr. An electrochemical mechanism for the formation of bromide-containing CAF has been proposed based on the XPS data. .
author2 Perovic, Doug
author_facet Perovic, Doug
Caputo, Antonio
author Caputo, Antonio
author_sort Caputo, Antonio
title Conductive Anodic Filament (CAF) Formation
title_short Conductive Anodic Filament (CAF) Formation
title_full Conductive Anodic Filament (CAF) Formation
title_fullStr Conductive Anodic Filament (CAF) Formation
title_full_unstemmed Conductive Anodic Filament (CAF) Formation
title_sort conductive anodic filament (caf) formation
publishDate 2010
url http://hdl.handle.net/1807/32038
work_keys_str_mv AT caputoantonio conductiveanodicfilamentcafformation
_version_ 1716581865638330368