A study on thermal shock crack due to SMT soldering process in multilayer ceramic capacitor

碩士 === 國立臺灣科技大學 === 工程技術研究所 === 81 ===

Bibliographic Details
Main Authors:	Scott Fey, 費耀祺
Other Authors:	Wei-Cherng Lu；Shuenn-Chang Her
Format:	Others
Language:	zh-TW
Published:	1993
Online Access:	http://ndltd.ncl.edu.tw/handle/25036442323847012746

id	ndltd-TW-081NTUST027196
record_format	oai_dc
spelling	ndltd-TW-081NTUST0271962016-02-10T04:08:46Z http://ndltd.ncl.edu.tw/handle/25036442323847012746 A study on thermal shock crack due to SMT soldering process in multilayer ceramic capacitor 積層陶瓷電容器因表面黏著技術錫銲製程導致熱衝擊裂痕的研究 Scott Fey 費耀祺碩士國立臺灣科技大學工程技術研究所 81 Wei-Cherng Lu；Shuenn-Chang Her 呂維成；何舜昌　 1993 學位論文 ; thesis 137 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立臺灣科技大學 === 工程技術研究所 === 81 ===
author2	Wei-Cherng Lu；Shuenn-Chang Her
author_facet	Wei-Cherng Lu；Shuenn-Chang Her Scott Fey 費耀祺
author	Scott Fey 費耀祺
spellingShingle	Scott Fey 費耀祺 A study on thermal shock crack due to SMT soldering process in multilayer ceramic capacitor
author_sort	Scott Fey
title	A study on thermal shock crack due to SMT soldering process in multilayer ceramic capacitor
title_short	A study on thermal shock crack due to SMT soldering process in multilayer ceramic capacitor
title_full	A study on thermal shock crack due to SMT soldering process in multilayer ceramic capacitor
title_fullStr	A study on thermal shock crack due to SMT soldering process in multilayer ceramic capacitor
title_full_unstemmed	A study on thermal shock crack due to SMT soldering process in multilayer ceramic capacitor
title_sort	study on thermal shock crack due to smt soldering process in multilayer ceramic capacitor
publishDate	1993
url	http://ndltd.ncl.edu.tw/handle/25036442323847012746
work_keys_str_mv	AT scottfey astudyonthermalshockcrackduetosmtsolderingprocessinmultilayerceramiccapacitor AT fèiyàoqí astudyonthermalshockcrackduetosmtsolderingprocessinmultilayerceramiccapacitor AT scottfey jīcéngtáocídiànróngqìyīnbiǎomiànniánzhejìshùxīhànzhìchéngdǎozhìrèchōngjīlièhéndeyánjiū AT fèiyàoqí jīcéngtáocídiànróngqìyīnbiǎomiànniánzhejìshùxīhànzhìchéngdǎozhìrèchōngjīlièhéndeyánjiū AT scottfey studyonthermalshockcrackduetosmtsolderingprocessinmultilayerceramiccapacitor AT fèiyàoqí studyonthermalshockcrackduetosmtsolderingprocessinmultilayerceramiccapacitor
_version_	1718184199894073344

A study on thermal shock crack due to SMT soldering process in multilayer ceramic capacitor

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