Electroless Nickel Bumps and Electroless Copper Plating of Nickel powders
碩士 === 國立清華大學 === 化學工程研究所 === 82 ===
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1993
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Online Access: | http://ndltd.ncl.edu.tw/handle/64913003417166320744 |
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ndltd-TW-082NTHU00630222016-07-18T04:09:47Z http://ndltd.ncl.edu.tw/handle/64913003417166320744 Electroless Nickel Bumps and Electroless Copper Plating of Nickel powders 無電鍍鎳凸塊及鎳粉的無電鍍銅 Chen, Shu Hui 陳淑惠 碩士 國立清華大學 化學工程研究所 82 Lee, Ting Yueh 李定粵 1993 學位論文 ; thesis 0 zh-TW |
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NDLTD |
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zh-TW |
format |
Others
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NDLTD |
description |
碩士 === 國立清華大學 === 化學工程研究所 === 82 ===
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author2 |
Lee, Ting Yueh |
author_facet |
Lee, Ting Yueh Chen, Shu Hui 陳淑惠 |
author |
Chen, Shu Hui 陳淑惠 |
spellingShingle |
Chen, Shu Hui 陳淑惠 Electroless Nickel Bumps and Electroless Copper Plating of Nickel powders |
author_sort |
Chen, Shu Hui |
title |
Electroless Nickel Bumps and Electroless Copper Plating of Nickel powders |
title_short |
Electroless Nickel Bumps and Electroless Copper Plating of Nickel powders |
title_full |
Electroless Nickel Bumps and Electroless Copper Plating of Nickel powders |
title_fullStr |
Electroless Nickel Bumps and Electroless Copper Plating of Nickel powders |
title_full_unstemmed |
Electroless Nickel Bumps and Electroless Copper Plating of Nickel powders |
title_sort |
electroless nickel bumps and electroless copper plating of nickel powders |
publishDate |
1993 |
url |
http://ndltd.ncl.edu.tw/handle/64913003417166320744 |
work_keys_str_mv |
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