| Summary: | 碩士 === 國立交通大學 === 電子研究所 === 83 === Micro-electro-mechanical systems( MEMS ) is a large field of
study, because it combines two major subjects, i.e., electronic
and mechanical engineering. Fabricated by IC technologies,
emp- loying diaphragm deformed by pressure to generate
electrical si- gnal, pressure sensor is the most representative
device in this topic. This thesis thus majors in the capacitive
pressure sensor in order to get into the field of MEMS.
Capacitive pressure sensor can be considered as the parallel
plates capacitor. One of the plates is a very thin diaphragm,
so it would be deformed as pressure varying and the capacitance
wo- uld be changed. Therefore, we can obtain the pressure value
by the altering value of the capacitance. Because the structure
of the pressure sensor device differs from the traditional IC's
devices, the ways of fabricating pressure sensor are also diff-
erent from traditional IC's technologies, such as KOH etching,
P+ diaphragm formation, anodic bonding technique etc. These all
will be extensively discussed in this thesis. At last, we
generally introduce the silicon sensors and some special
fabricating processes or thinkings about micromachining field
in order to understand this topic extensively.
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