Capacitive pressure sensor

碩士 === 國立交通大學 === 電子研究所 === 83 === Micro-electro-mechanical systems( MEMS ) is a large field of study, because it combines two major subjects, i.e., electronic and mechanical engineering. Fabricated by IC technologies, emp- loying diaphrag...

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Main Authors: Yung-Nian Teng, 鄧永年
Other Authors: Kow-Ming Chang
Format: Others
Language:en_US
Published: 1995
Online Access:http://ndltd.ncl.edu.tw/handle/31274139779962345769
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spelling ndltd-TW-083NCTU04300772015-10-13T12:53:37Z http://ndltd.ncl.edu.tw/handle/31274139779962345769 Capacitive pressure sensor 電容式壓力感測器 Yung-Nian Teng 鄧永年 碩士 國立交通大學 電子研究所 83 Micro-electro-mechanical systems( MEMS ) is a large field of study, because it combines two major subjects, i.e., electronic and mechanical engineering. Fabricated by IC technologies, emp- loying diaphragm deformed by pressure to generate electrical si- gnal, pressure sensor is the most representative device in this topic. This thesis thus majors in the capacitive pressure sensor in order to get into the field of MEMS. Capacitive pressure sensor can be considered as the parallel plates capacitor. One of the plates is a very thin diaphragm, so it would be deformed as pressure varying and the capacitance wo- uld be changed. Therefore, we can obtain the pressure value by the altering value of the capacitance. Because the structure of the pressure sensor device differs from the traditional IC's devices, the ways of fabricating pressure sensor are also diff- erent from traditional IC's technologies, such as KOH etching, P+ diaphragm formation, anodic bonding technique etc. These all will be extensively discussed in this thesis. At last, we generally introduce the silicon sensors and some special fabricating processes or thinkings about micromachining field in order to understand this topic extensively. Kow-Ming Chang 張國明 1995 學位論文 ; thesis 90 en_US
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language en_US
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description 碩士 === 國立交通大學 === 電子研究所 === 83 === Micro-electro-mechanical systems( MEMS ) is a large field of study, because it combines two major subjects, i.e., electronic and mechanical engineering. Fabricated by IC technologies, emp- loying diaphragm deformed by pressure to generate electrical si- gnal, pressure sensor is the most representative device in this topic. This thesis thus majors in the capacitive pressure sensor in order to get into the field of MEMS. Capacitive pressure sensor can be considered as the parallel plates capacitor. One of the plates is a very thin diaphragm, so it would be deformed as pressure varying and the capacitance wo- uld be changed. Therefore, we can obtain the pressure value by the altering value of the capacitance. Because the structure of the pressure sensor device differs from the traditional IC's devices, the ways of fabricating pressure sensor are also diff- erent from traditional IC's technologies, such as KOH etching, P+ diaphragm formation, anodic bonding technique etc. These all will be extensively discussed in this thesis. At last, we generally introduce the silicon sensors and some special fabricating processes or thinkings about micromachining field in order to understand this topic extensively.
author2 Kow-Ming Chang
author_facet Kow-Ming Chang
Yung-Nian Teng
鄧永年
author Yung-Nian Teng
鄧永年
spellingShingle Yung-Nian Teng
鄧永年
Capacitive pressure sensor
author_sort Yung-Nian Teng
title Capacitive pressure sensor
title_short Capacitive pressure sensor
title_full Capacitive pressure sensor
title_fullStr Capacitive pressure sensor
title_full_unstemmed Capacitive pressure sensor
title_sort capacitive pressure sensor
publishDate 1995
url http://ndltd.ncl.edu.tw/handle/31274139779962345769
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AT yungnianteng diànróngshìyālìgǎncèqì
AT dèngyǒngnián diànróngshìyālìgǎncèqì
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