The Study on Etching Wastewater of Printed Circuit Board Treated by Wet Air Oxidation Process

碩士 === 國立中央大學 === 環境工程研究所 === 83 === Wet Air Oxidation (WAO) process was used in this study alternatively to investigate the characteristic of the COD removal and BOD5/COD enhancement. Reaction temperature, time, and oxygen supply are considered to be imp...

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Bibliographic Details
Main Authors: Bih-Chieh Chang, 張必杰
Other Authors: Kuen-Sheng Wang
Format: Others
Language:zh-TW
Published: 1995
Online Access:http://ndltd.ncl.edu.tw/handle/77972005502209783034
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Summary:碩士 === 國立中央大學 === 環境工程研究所 === 83 === Wet Air Oxidation (WAO) process was used in this study alternatively to investigate the characteristic of the COD removal and BOD5/COD enhancement. Reaction temperature, time, and oxygen supply are considered to be important factors affecting the degradation of the PCBW. A three-factorial experiment was designed with temperature ranged from 210-270 deg C, oxygen supply 1.0-1.5 times COD, and reaction time 0-60 min. The result of the experiments showed that reaction temperature, time and oxygen supply are all important factors. The maximum reaction rate occurred at time 5-15 min. from the beginning of the reaction. The increase in COD concentration in the first five minutes indicated that in the solids in PCBW released some organic polymer which was not accounted by the COD analysis of the initial PCBW. The releasing was enchanted by increasing temperature and oxygen supply. The maximum COD and TOC reduction, 49.9% and 54.1% were found at reaction temperature 270 deg C and 1.5 time oxygen supply to COD after 60 min of reaction. The maximum ratio of BOD5/COD was raised to 0.65. The reaction rate of COD can be predicated by a model of two first order reactions in series. A COD reaction rate model was established. The reaction order within 15-60 min. is unit for COD degradation and 0.23 for oxygen supply. The activation energy (Ea) was found to be 23160 J/mole.