| Summary: | 碩士 === 元智大學 === 化學工程研究所 === 83 === The feasibility of using waste printed circuit boards (PCB) as
reinforcing fillers in manufacturing composite materials isd
using infrared spectroscopy, differential scanning calorimetry
(DSC), mechanical test, and scanning electron microscopy
(SEM). From measurement, it was obtained that the addition of
PCB couldthe free radical reaction of the unsaturated polyester
(UP) resin and decrease curing rates at the beginning stages,
and lower theate conversion. The methods of surface treatments
also affected thering reaction of the UP resin. PCB added UP
resins all have higher Tg, tougher, and stronger than the
unmodified UP because of energy dissipation effects ofass
fibers and rigid epoxy resins in the PCB. The impact energy
ofe specimen increased with increasing the loading of the added
PCB powders. The 0.75 mm PCB was more effective in promoting
the toughness of the UP matrix than 0.25 mm PCB. While 0.25 mm
PCB added specimens were stronger than 0.75 mm PCB reinforceds.
As much as 150 parts per hundred PCB can be added in the UP.
The size of added PCB, the amounts of glass fibers, and the
degree ofrsion of PCB in the UP all can affect properties of
the moldedThe glycidyl methacrylate (GMA) treated PCB
deteriorated thes of the UP but Z-6030 silane was effective in
promoting the properties of the molded composites . From SEM
pictures ofre surfaces impact specimens, it was obtained that
the fracture wasnitiated from the resin matrix for all
specimens tested and few copper was detected on the fracture
surfaces. Moreover,all molded composites satisfied the copper
evolution requirement of the EPA. All PCB added composites had
evolution concentrations of copper ions below 15 parts per
million (ppm)the specimens modified with 0.75 mm PCB had the
lowest concentrationf copper ion. Production of UP composites
from waste PCB wased.
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