Numerical Study of Wire Sweep Phenomena in IC Packaging

Numerical Study of Wire Sweep Phenomena in IC Packaging

碩士 === 國立成功大學 === 機械工程研究所 === 84 ===

Bibliographic Details
Main Authors:	Ming-Hung Cheng, 陳明宏
Other Authors:	Sheng-Jye Hwang
Format:	Others
Language:	zh-TW
Published:	1996
Online Access:	http://ndltd.ncl.edu.tw/handle/62144731077531207627

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