Chemical Mechanical Polishing of PECVD Dielectrics：Characterization and Processs Integration

Chemical Mechanical Polishing of PECVD Dielectrics：Characterization and Processs Integration

碩士 === 國立交通大學 === 材料科學工程研究所 === 84 ===

Bibliographic Details
Main Authors:	Lin, Qi-Fa, 林啟發
Other Authors:	Ping, Ming-Xian
Format:	Others
Language:	zh-TW
Published:	1996
Online Access:	http://ndltd.ncl.edu.tw/handle/08396109180397390113

Similar Items

Chemical Mechanical Polishing of PECVD Dielectrics: Characterization and Process Integration
by: Lin, Chi-Fa, et al.
Published: (1996)

Chemical-Mechanical Polishing and Material Characterization of Low Dielectric Constant PECVD Fluorinated Oxide Thin Films
by: Hsieh, Yuan-Tsu, et al.
Published: (1996)

The Process’s Effectiveness in Popular Actions
by: Rafael Vieira de Alencar, et al.
Published: (2016-10-01)

Chemical-Mechanical Polishing Characterization of Low Dielectric Constant Polymers
by: Yen, Cheng-tyng, et al.
Published: (1999)

A Preprocessor for A Parallel Processsing System
by: Lee, ChenYu, et al.
Published: (1997)

Modeling of chemical mechanical polishing for dielectric planarization
by: Ouma, Dennis Okumu
Published: (2005)

Possibilities of the electrochemical drilling process’s (ECM) vibroacoustic analysis
by: Troszyń ski Adam, et al.
Published: (2018-01-01)

Characterizations of PECVD Dielectric Films on In0.53Ga0.47As
by: Chih-Cheng Lu, et al.
Published: (1999)

Theoretical and Practical Aspects of Dielectric Chemical- Mechanical Polishing
by: Liu ,Chi-Wen, et al.
Published: (1996)

Preparation of Ultrafine Alumina Powder and Characterization of Abrasives for Chemical-Mechanical Polishing of Polymer Dielectrics
by: Chuan-Ping Hou, et al.
Published: (2000)

Impacts of CVD Dielectric Characteristics on ULSI CMP Process and Memory Devices Performance
by: Chi-fa Lin, et al.
Published: (1999)

Analysis of Optimization Processses for Solid State Fabrication of Olivine Cathode Materials

SELF-ADAPTIVE SOFTWARE DESIGN BASED ON THE COMPUTING PROCESS’S TRACE TECHNOLOGY
by: A. S. Bozhday, et al.
Published: (2020-10-01)

Device independent process control of dielectric chemical mechanical polishing
by: Smith, Taber H. (Taber Hardesty)
Published: (2014)

PECVD SiON for Integrated Optical Microsensor
by: Lin, Wen-Mei, et al.
Published: (1997)

Robust and Efficient Techniques for Adaptive Array Signal Processsing of Multiple Beam Antenna
by: Hsu, Ti-Fei, et al.
Published: (1999)

The Neural Network Revamping the Process’s Reliability in Deep Lean via Internet of Things
by: Ahmed M. Abed, et al.
Published: (2020-06-01)

Modeling of dielectric erosion and copper dishing in copper chemical-mechanical polishing
by: Noh, Kyungyoon
Published: (2006)

Development of fermentation processs for the production of a natural anti-tumor drugs-prodiogiosin by microorganism
by: Chiao-Ling Hsu, et al.
Published: (2008)

Chemical-Mechanical Polishing of Low Dielectric Constant Spin-On Glass Thin Films
by: Chang, Shih-Tzung, et al.
Published: (1997)

Study on Chemical-Mechanical Polishing of Low-Dielectric Constant Polyimide Thin Films
by: Ya-Li Tai, et al.
Published: (1999)

Modeling the Development of Prereaders' Phonological Processsing Skills: A Latent Variable Longitudinal Study

Unilateral plea bargain as a logical result of the Brazilian due process’s constitucional guidelines
by: Marcos Paulo Dutra Santos
Published: (2017-03-01)

Lateralization of pragmatic processsing : a visual half-field investigation of speech act processing
by: Weywadt, Christina R.
Published: (2011)

Characterization and Modeling of Mainstream and Alternative Conditioning and Polishing Technologies in Inter-Layer Dielectric and Copper Chemical Mechanical Planarization
by: Lee, Hyosang
Published: (2008)

A Case Study of Processs on Native Curriculum - Sweet Potato Program for Eary Childhood Education
by: Yi-Nung Chen, et al.
Published: (2003)

Characterization and modeling of uniformity in chemical mechanical polishing
by: Oji, Charles (Charles Ojih), 1974-
Published: (2013)

Nanostructural, Chemical, and Mechanical Features of nc-Si:H Films Prepared by PECVD
by: Jong-Ick Son, et al.
Published: (2012-01-01)

Study on Ultra-fine Abrasive and Slurry of Chemical Mechanical Polishing for Low Dielectric Constant Materials
by: Wen-Chen Shih, et al.
Published: (1999)

Assessment of the Water Treatment Process’s Empirical Model Predictions for the Management of Aesthetic and Health Risks Associated with Cyanobacteria
by: Arash Zamyadi, et al.
Published: (2018-05-01)

Interface mechanics of chemical mechanical polishing for integrated circuit planarization
by: Levert, Joseph Albert
Published: (2007)

Characterization and modeling of polysilicon MEMS chemical-mechanical polishing
by: Tang, Brian D. (Brian David), 1980-
Published: (2005)

Chemical mechanical polishing analyzing and design of polishing head with polishing path discussing in face-up chemical mechanical polishing system
by: 巫建儀
Published: (2003)

Copper Dishing Behavior During Chemical Mechanical Polishing
by: Jia-Bin Lin, et al.
Published: (2002)

Growth characteristics of hydrogenated amorphous carbon thin films with low dielectric constant prepared by PECVD
by: Sei-Ping Louh, et al.
Published: (2006)

Preparation and Characterization of Polishing Slurry Composition on Stainless Steel Substrates for Chemical Mechanical Polishing Processes
by: Wen-Cheng Liu, et al.
Published: (2017)

Energy Conservation Design of Office Building Envelope in Asia
by: Qi-Fa Lin, et al.
Published: (2006)

Characterization of chemical mechanical polishing process based on film properties
by: Chien-Hung Liu, et al.
Published: (1995)

Os desafios e as barreiras das bibliotecas universitérias brasileiras e portuguesas no processs de inclusão e acessibilidade
by: Isabel Cristina dos Santos Diniz, et al.
Published: (2017-09-01)

Usefulness of the Inferior Articular Process’s Cross-Sectional Area as a Morphological Parameter for Predicting Central Lumbar Spinal Stenosis
by: Sooho Lee, et al.
Published: (2020-01-01)