The effects of electric current upon the interfacial reactions at joints

The effects of electric current upon the interfacial reactions at joints

碩士 === 國立清華大學 === 化學工程學系 === 85 ===

Bibliographic Details
Main Authors:	Liu, Wen-Chyuran, 劉文銓
Other Authors:	Chen Sinn-Wen
Format:	Others
Language:	zh-TW
Published:	1997
Online Access:	http://ndltd.ncl.edu.tw/handle/36158015070029626912

Similar Items

Effect of electric current stressing on interfacial reactions at soldered junctions of thermoelectric modules
by: Chen, Wen-Tai, et al.
Published: (2011)

Magnetic effects upon interfacial reactions
by: Yu-Hsiang Lee, et al.

The Effect of Convection Upon the interfacial Reactions in the Soldering Process
by: 林朝青
Published: (1998)

An Interfacial Reaction Study on the Solder Joint of the Rework Lead Free Components
by: Ming-chuan Chen, et al.
Published: (2005)

Electric current effects on Sn-15at%Sb/Cu(Ag) interfacial reactions
by: WANG,CHIH,HSIEN, et al.
Published: (2016)

Size and interfacial reactions effects upon undercooling of Pb-free solders
by: Kuan-Hsien Wu, et al.
Published: (2008)

Effects of Fe Additions upon Interfacial Reactions between Solders and Substrates
by: Chia-Yu Wei, et al.
Published: (2017)

Electric current effect upon materials lattice stability
by: Yu-chenLiu, et al.
Published: (2019)

Electromigration effects upon interfacial reactions between lead-free solders and substrates
by: Chih-ming Chen, et al.
Published: (2002)

Effects of Ga addition upon Sn-58Bi/ Cu Interfacial reactions
by: Trong LanNguyen, et al.
Published: (2013)

The effects of strain on Ni/Sn interfacial reactions
by: Wen-Kai Liao, et al.
Published: (2011)

Sb/Co, Co/Sb2Te3 and Ni/Sb2Te3 interfacial reactions and electromigration effects upon interfacial reactions
by: Chen, Jing-Wei, et al.
Published: (2017)

THE CROSS-INTERACTION OF TWO INTERFACIAL REACTIONS IN SOLDER JOINTS
by: Chien-wei Chang, et al.
Published: (2007)

Volume Shrinkage Induced by Interfacial Reaction In Micro Joints
by: Cheng-Chieh Li, et al.
Published: (2014)

The Effects of the Solder Composition on Interfacial Reactions in Flip-Chip Solder Joints
by: Chih-Chiang Chang, et al.
Published: (2010)

Interfacial reactions of SiC and Kovar joint using Ti-Ni-Ti foils
by: 劉承維
Published: (2011)

Interfacial reaction and joint strength of In-Bi solder on Cu substrate
by: Jeng-Yu Chiang, et al.
Published: (2018)

Interfacial Reactions in Flip-Chip High-Lead Solder Joint
by: Kai-Jheng Wang, et al.
Published: (2006)

Investigation of interfacial reaction and microstructure of high temperature solder joint
by: Wei-ShiuanWu, et al.
Published: (2015)

Interfacial Reaction and Mechanical Properties of Sn-Bi Solder joints
by: Fengjiang Wang, et al.
Published: (2017-08-01)

The effect of an electric current upon the elasticity of wires
by: Dodge, Homer Levi
Published: (1912)

Phase Equilibria of the Sn-Sb-Ni Ternary System and Interfacial Reaction at the Sn-Sb/Ni joints
by: Ling-Ling Liu, et al.
Published: (2010)

Effects upon the Sn/Ni and Sn/Cu interfacial reactions with minor additions of Cu and Ni into Sn
by: 吳蒔涵
Published: (2003)

Effects of mechanically applied stress on tin whisker growth and interfacial reactions at solder joints
by: Yu-Jen Chen, et al.
Published: (2009)

Interfacial reactions and microstructural evolutions of the solder joints in electronic and thermoelectric devices
by: Chao-hong Wang, et al.
Published: (2008)

Coupling Effects between Two Interfacial Soldering Reactions in Flip-Chip Solder Joint
by: Shen-Jie Wang, et al.
Published: (2006)

Interfacial reactions at the Sn/(Cu,Ni) joints and mechanical properties of the Sn-Cu/Ni joints
by: Shou-wei Lee, et al.
Published: (2003)

Analysis of interfacial reaction during the formation of Pb-free solder joint
by: Chee-Key Chung, et al.
Published: (2012)

Current density effect on the interfacial reaction between Sn5Ag/Cu
by: Yu-ting Yeh, et al.
Published: (2008)

Interfacial reactions between high current electroplated copper and tin
by: Chien-Hung Lin, et al.
Published: (2019)

Investigations on the Interfacial Reaction, Shear and Electrical Properties of Sn-Ag-Cu Solder Joints with Sn-Zn-Bi Paste Addition
by: Po-Cheng Shih, et al.
Published: (2006)

Effects of Ultrasound on the Interfacial Reactions and Mechanical Properties of High Strength Aluminum Alloy Soldering Joints
by: Ming-Tsung Kao, et al.
Published: (2013)

Interfacial Reactions of Copper Thin Films on Silicon
by: Liu, Chung Shi, et al.
Published: (1995)

The Choice of Surface Finishes for Solder Joint and the Interfacial Reactions by Solid-State Bonding
by: Chi-Pu Lin, et al.
Published: (2012)

Effect of Cu concentration on the interfacial reactions between Ni and Sn-Cu solders
by: Wen-Tai Chen, et al.
Published: (2002)

Interfacial reactions in the Bi2Te3-based thermoelectric modules
by: Liu, Zi Wen, et al.
Published: (2016)

Electrical phenomena observed upon rapid separation of mercury from interfacial contact with methylmethacrylate polymer
by: Palmer, Philip Maynard
Published: (2012)

Interfacial Reaction between Diffusion Barrier and Thermoelectric Materials under Current
by: Li-Chen Lo, et al.
Published: (2012)

Interfacial reactions in thermoelectric modules
by: Hsin-jay Wu, et al.
Published: (2018-04-01)

Interfacial reaction and electrical performances between silver paste and silicon substrate
by: Jung-Ting Tsai, et al.
Published: (2012)

Cannot write session to /tmp/vufind_sessions/sess_n1hmpafmvegs6hp345h21orfh9