Simulation and Optimization of MCM Interconnections

• Main Authors: Chen, Ming-Chi, 陳明奇
• Other Authors: Feng Wu-Shiung
• Format: Others
• Language: zh-TW
• Published: 1997
• Online Access: http://ndltd.ncl.edu.tw/handle/10625596669140722965

碩士 === 國立臺灣大學 === 電機工程學系 === 85 === To take full advantage of the increased speed and density of VLSI circuits, multichip modules ( MCMs ) have been developed to reduce signal delay, power requirements, and the physical size of electronic systems. However, as more chips are placed in the same package, the line density will greatly increase. This can result in serious signal distortions. In order to ensure the performance of an MCM-based system, the interconnections between bare chips must be designed carefully. In this thesis, we develop a dedicated simulation system to analyze MCM interconnection networks and help the package designers to find the optimal design. This simulation system consists of three parts, namely, parameter calculator, circuit simulator, and circuit optimizer. The parameter calculator evaluates the transmission-line parameters of interconnections. These parameters are fed into the circuit simulator to determine the time-domain response of an MCM interconnection network. If the circuit responsdoes not satisfy the performance specifications, the circuit optimizer can help us to find the optimalhe simulation results are also compared with the results from empirical formulas, references and another circuit simulator, HSPICE. Very good agreement is observed.