| Summary: | 碩士 === 國立成功大學 === 機械工程學系 === 86 === High speed IC chip and its packaging make the heatconduction in
wave nature dominate in thermal transfer process. This paper is
addressed on the wave behavior of thermal propagation of IC
chip. Instead of the classic Fourier equation based on diffusion
mechanism, a finite speed propagation model in spherical system
expressed in a hyperbolic equation was used to predict the
transient process of heat conduction in IC chip, when a heat
source with a square-corner switching wave form was applied. The
peak temp temperature, spatial difference and time variation of
wave behavior are given and compared with that obtained from
Fourier equation. The present study introduces analytical and
numerical algorithms individually to analyze the non-fourier
heat conduction in IC chip in spherical system, and compares
their results with each other. The present study also introduces
a hybrid numerical method which combines the Laplace transform
technique and the control volume method in conjunction with the
least square scheme to investigate the inverse
problemsconcerning the relationship between the failure power
and failure time. It is shown that the failure process is
greatly affected by the occurrence of thermal wave, and then can
be divided into four time domains, wave region, adiabatic
region, diffusion region and steady region.
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