The physical properties and application of solder glass

• Main Authors: Chang, Chih-Lung, 張秩隆
• Other Authors: Tsai Chiitang
• Format: Others
• Language: zh-TW
• Published: 1998
• Online Access: http://ndltd.ncl.edu.tw/handle/47834353416431734536

碩士 === 中國文化大學 === 應用化學研究所 === 86 === The soldering procedure of sealing were examined by check the hermetical properties between soider glass and stainless steel. The chemical composition of these two kinds solder glass were determined by using ICP. At the same time,the thermal properties and crystallization behavior of solder glass were studied by DTA(differential thermal analysis). Then ,the heat treatment procedure of soldering was arranged by using the DTA thermogram .The devitrification mechanism and kinetic parameters of solder glass were investigated using non-isothermal technique(DTA) .Experimental results suggested that the devitrification mechanism of these two kinds solder glass were almost dominated by surface nucleation.The activation energies of devitrification solder glass were 56.04Kcal/mole for grey sample and 54.27Kcal/mole for blue one. This result were close to that of other kinds of solder glass. The expansion coefficient 、 possible crystalline phase 、spread capacity 、Vicker's hardness and hermetical properties of solder glass were also disscussed in this work .From the hermetical test, the leakage rate of sealing interface was found to be less than 1 × 10^-5atm.cc/ sec. It met the basic requirement of electric parts. This result showed the applicability of the procedure of heat treatment suggested in this work.