| Summary: | 碩士 === 國立成功大學 === 化學工程學系 === 87 === Abstract
Diamond-like carbon films have many excellent physical and chemical properties，and thus have high potentials in many industrial applications.
However，diamond-like carbon films have been suffering from the large internal compressive stress and thermal instability. The large stress induces the poor adhesion of films to the substrates. The thermal instability reduces the service lifetime of the film.
First, Ti nano clusters have been incorporated in the DLC films forming a composite film to enhance its toughness, hopefully not sacrificing much the hardness. TEM observation identified 6-70nm Ti clusters in the DLC film.
Besides，HMDSO was employed to deposit the DLC films incorporating Si-O-Si functional groups. The Si-O groups are homogeneously distributed in the DLC films. And the film adhesion was greatly improved up to 50N.
Raman spectra showed that the structure was unchanged after thermal treatments at 400℃ for 2hrs.
Films adhesion of the SiO-Containing DLC/DLC was compared with that of the gradient TiN/TiC/DLC layers by scratching test. The critical load for the SiO-containing DLC/DLC gradient layer was 22.4N，very close to 24.3N for the TiN/TiC/DLC gradient layer.
Finally, the film growth rate using HMDSO was slower than that using CH4，likely due to the sputtering of the film by the heavy HMDSO molecules, It is therefore suggested that the growth rate can be enhanced by depositing the film using higher RF power at higher pressure.
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