The Investigation of Reflow Shape of 95Pb-5Sn Solder Paste
碩士 === 國立成功大學 === 材料科學及工程學系 === 87 === Abstract This present work investigated the variation in shape and height of the reflow solder paste. In this experiment, alloy component of solder paste is 95% Pb-5% Sn. Substrate material is nickel-plated copper, and solder pad is defined by poo...
| Main Authors: | , |
|---|---|
| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
|
| Online Access: | http://ndltd.ncl.edu.tw/handle/19419079812340533133 |