Reliability Issues of Passivation Layers against Copper Oxidation and Barrier Layers against Copper Diffusion in Copper Metallization for ULSI Application
博士 === 國立交通大學 === 電子工程系 === 87 === This thesis studies the passivation capability against Cu oxidation for the Ta-based and Cr-based passivation layers of 200A thickness as well as the barrier capability against Cu diffusion for the Cr-based and Mo-based barrier layers of 500A thickness. The passiva...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | en_US |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/76285130884110771559 |