Electrochemical deposition Process for ULSI copper interconnect fabrication

碩士 === 國立清華大學 === 化學工程學系 === 87 ===

Bibliographic Details
Main Author: 馮憲平
Other Authors: C.C.Wan
Format: Others
Language:zh-TW
Published: 1999
Online Access:http://ndltd.ncl.edu.tw/handle/21701027568809907608
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spelling ndltd-TW-087NTHU00630062016-07-11T04:13:20Z http://ndltd.ncl.edu.tw/handle/21701027568809907608 Electrochemical deposition Process for ULSI copper interconnect fabrication 電化學程序沉積超大型積體電路銅內連線之研究 馮憲平 碩士 國立清華大學 化學工程學系 87 C.C.Wan 萬其超 1999 學位論文 ; thesis 0 zh-TW
collection NDLTD
language zh-TW
format Others
sources NDLTD
description 碩士 === 國立清華大學 === 化學工程學系 === 87 ===
author2 C.C.Wan
author_facet C.C.Wan
馮憲平
author 馮憲平
spellingShingle 馮憲平
Electrochemical deposition Process for ULSI copper interconnect fabrication
author_sort 馮憲平
title Electrochemical deposition Process for ULSI copper interconnect fabrication
title_short Electrochemical deposition Process for ULSI copper interconnect fabrication
title_full Electrochemical deposition Process for ULSI copper interconnect fabrication
title_fullStr Electrochemical deposition Process for ULSI copper interconnect fabrication
title_full_unstemmed Electrochemical deposition Process for ULSI copper interconnect fabrication
title_sort electrochemical deposition process for ulsi copper interconnect fabrication
publishDate 1999
url http://ndltd.ncl.edu.tw/handle/21701027568809907608
work_keys_str_mv AT féngxiànpíng electrochemicaldepositionprocessforulsicopperinterconnectfabrication
AT féngxiànpíng diànhuàxuéchéngxùchénjīchāodàxíngjītǐdiànlùtóngnèiliánxiànzhīyánjiū
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