The Analysis of Flip Chip Underfill and Observation of Flow Pattern
碩士 === 國立臺灣大學 === 機械工程學研究所 === 87 === Currently, most flip chip are encapsulated by dispensing the encapsulant along the partial periphery of the chip. The encapsulant is driven by capillary force flows through the space between the chip and the substrate (board). The filling time is the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
1999
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| Online Access: | http://ndltd.ncl.edu.tw/handle/53339846147802272567 |