The Study of the Interactive Due Date Commitment and Production Schedule Model in Semiconductor Packaging Factory

• Main Authors: Ying-Ming Lee, 李英明
• Other Authors: Horn-Hua Wu
• Format: Others
• Language: zh-TW
• Published: 2000
• Online Access: http://ndltd.ncl.edu.tw/handle/26393221632402101789

碩士 === 中華大學 === 工業工程與管理研究所 === 88 === After an order is submitted in a semiconductor packaging factory, the next manufacture and management problems, such as scheduling or evaluating due date etc., have to be undertaken by the production staffs first in order to officially confirm the feasible due date and production schedule. One of the main reasons is because the product quantity cannot be precisely translated into the production capacity in the timely demand. Before these obstacles are resolved reasonably, the ordering system cannot provide the real time due date commitment so as to interactively coordinate the production people with the market people or customers. In this study, the interactive due date commitment model based on the Drum-Buffer-Rope Management System is proposed to overcome the above problems. The CTP(Capacity to Promise) concept is utilized to coordinate the due date with customer interactively. After the due date is confirmed, the last production and material issued schedule can be generated automatic. A profile system is designed in this paper to demo the effectiveness. This model not only can be utilized to construct the interactive due date commitment system for the semiconductor packaging factory, but also can be applied to the B2B manufacturing service or the Virtual Factory.