Modeling of Electrical Characteristics and Analysis of Signal Integrity for Electronic Packages

• Main Authors: Shinn-Jong Li, 李信忠
• Other Authors: Huey-Ru Chuan
• Format: Others
• Language: zh-TW
• Published: 2000
• Online Access: http://ndltd.ncl.edu.tw/handle/84791911620505557005

碩士 === 國立成功大學 === 電機工程學系 === 88 === Abstract In this thesis, extensive measurement, modeling and electromagnetic simulation are performed to construct the electrical characteristics and equivalent circuit models of BGA electronic packages. In frequency-domain measurement,the vector network analyzer (VNA) is used to measure S parameters. The equivalent circuit models are extracted from the measured data through the optimization scheme of HP MDS CAD tool. While in the time-domain measurement, by following JEDEC guidelines, the time domain reflectometry (TDR) is used to measure the time-domain response. By using the Tektronix-IPA 510 software, the parameters of the equivalent circuits can be extracted. In electromagnetic simulation, Maxwell Quick-3D of Ansoft-SI which utilizes the quasi-static approach, is used to simulate the BGA 3-D structure for the construction of equivalent circuits. Simulation and measured results are compared to establish a proper equivalent circuit model for the BGA package. Finally, the signal integrity analysis of the system is performed to examine the effects of the BGA electronic packages to high-frequency/high-speed circuits.