Thin Film Stress Analysis of Active Devices on the Plastic Substrates

• Main Authors: Chih-Chuan Hsu, 許至全
• Other Authors: 葉清發
• Format: Others
• Language: en_US
• Published: 2000
• Online Access: http://ndltd.ncl.edu.tw/handle/58837065600763892633

碩士 === 國立交通大學 === 電子工程系 === 88 === In recent years, increasing requirement of modern household appliances promote the application range of small or large size Liquid Crystal Displays (LCDs) extensively. Among all types of LCDs, polymer-film LCDs (PFLCDs) are adequate for the tendency of product improvement. Plastic substrates have the advantages of low cost, light-weighted, thin-shaped , and rugged characteristics. However, when a deposited film is formed on the plastic substrates, a deformation or a curl of the plastic substrates are caused and high thin film stresses are induced, resulting in peeling of a film. It is therefore an object to provide active devices with high reliability, which allows to reduce weight and production cost, and to avoid curl of the plastic substrate, a peeling and crack of a film. In order to attain the mentioned object, it is indispensable to form a buffer layer in order to obtain an adhesion, stress alleviation, and reliability of the plastic substrate and the active device. We estimate the feasibility of varied buffer layer structures, and the thin film stress is also measured. Further, reliability tests are carried out for varied feasible buffer layer structure, the relations between thin film stress and reliability will be discussed. Eventually, Metal-Insulator-Metal diodes (MIM diodes) on plastic substrates are fabricated and influences of thin film stress on characteristics of MIM are also discussed in the thesis.