Thin Film Stress Analysis of Active Devices on the Plastic Substrates
碩士 === 國立交通大學 === 電子工程系 === 88 === In recent years, increasing requirement of modern household appliances promote the application range of small or large size Liquid Crystal Displays (LCDs) extensively. Among all types of LCDs, polymer-film LCDs (PFLCDs) are adequate for the tendency of p...
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ndltd-TW-088NCTU04280982015-10-13T10:59:52Z http://ndltd.ncl.edu.tw/handle/58837065600763892633 Thin Film Stress Analysis of Active Devices on the Plastic Substrates 塑膠基板上薄膜應力對主動式元件特性之影響分析 Chih-Chuan Hsu 許至全 碩士 國立交通大學 電子工程系 88 In recent years, increasing requirement of modern household appliances promote the application range of small or large size Liquid Crystal Displays (LCDs) extensively. Among all types of LCDs, polymer-film LCDs (PFLCDs) are adequate for the tendency of product improvement. Plastic substrates have the advantages of low cost, light-weighted, thin-shaped , and rugged characteristics. However, when a deposited film is formed on the plastic substrates, a deformation or a curl of the plastic substrates are caused and high thin film stresses are induced, resulting in peeling of a film. It is therefore an object to provide active devices with high reliability, which allows to reduce weight and production cost, and to avoid curl of the plastic substrate, a peeling and crack of a film. In order to attain the mentioned object, it is indispensable to form a buffer layer in order to obtain an adhesion, stress alleviation, and reliability of the plastic substrate and the active device. We estimate the feasibility of varied buffer layer structures, and the thin film stress is also measured. Further, reliability tests are carried out for varied feasible buffer layer structure, the relations between thin film stress and reliability will be discussed. Eventually, Metal-Insulator-Metal diodes (MIM diodes) on plastic substrates are fabricated and influences of thin film stress on characteristics of MIM are also discussed in the thesis. 葉清發 2000 學位論文 ; thesis 92 en_US |
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碩士 === 國立交通大學 === 電子工程系 === 88 === In recent years, increasing requirement of modern household appliances promote the application range of small or large size Liquid Crystal Displays (LCDs) extensively. Among all types of LCDs, polymer-film LCDs (PFLCDs) are adequate for the tendency of product improvement. Plastic substrates have the advantages of low cost, light-weighted, thin-shaped , and rugged characteristics. However, when a deposited film is formed on the plastic substrates, a deformation or a curl of the plastic substrates are caused and high thin film stresses are induced, resulting in peeling of a film.
It is therefore an object to provide active devices with high reliability, which allows to reduce weight and production cost, and to avoid curl of the plastic substrate, a peeling and crack of a film. In order to attain the mentioned object, it is indispensable to form a buffer layer in order to obtain an adhesion, stress alleviation, and reliability of the plastic substrate and the active device.
We estimate the feasibility of varied buffer layer structures, and the thin film stress is also measured. Further, reliability tests are carried out for varied feasible buffer layer structure, the relations between thin film stress and reliability will be discussed. Eventually, Metal-Insulator-Metal diodes (MIM diodes) on plastic substrates are fabricated and influences of thin film stress on characteristics of MIM are also discussed in the thesis.
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author2 |
葉清發 |
author_facet |
葉清發 Chih-Chuan Hsu 許至全 |
author |
Chih-Chuan Hsu 許至全 |
spellingShingle |
Chih-Chuan Hsu 許至全 Thin Film Stress Analysis of Active Devices on the Plastic Substrates |
author_sort |
Chih-Chuan Hsu |
title |
Thin Film Stress Analysis of Active Devices on the Plastic Substrates |
title_short |
Thin Film Stress Analysis of Active Devices on the Plastic Substrates |
title_full |
Thin Film Stress Analysis of Active Devices on the Plastic Substrates |
title_fullStr |
Thin Film Stress Analysis of Active Devices on the Plastic Substrates |
title_full_unstemmed |
Thin Film Stress Analysis of Active Devices on the Plastic Substrates |
title_sort |
thin film stress analysis of active devices on the plastic substrates |
publishDate |
2000 |
url |
http://ndltd.ncl.edu.tw/handle/58837065600763892633 |
work_keys_str_mv |
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