The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process
碩士 === 國立中山大學 === 機械工程學系研究所 === 88 === Abstract: The main aim of this paper is to utilizing the Shadow Moirè method to study the moisture effect on the warpage of PBGA IC package under the IR-reflow process. An environmental controlled box is designed and built. Three combinations of different moist...
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ndltd-TW-088NSYS54900782016-07-08T04:22:58Z http://ndltd.ncl.edu.tw/handle/67751684491320976619 The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process 半導體構裝體於不同溫濕保存環境下經IR-reflow過程後翹曲現象之研究 Chien-Hsiung Hung 洪健雄 碩士 國立中山大學 機械工程學系研究所 88 Abstract: The main aim of this paper is to utilizing the Shadow Moirè method to study the moisture effect on the warpage of PBGA IC package under the IR-reflow process. An environmental controlled box is designed and built. Three combinations of different moisture and temperature status are chosen for the purpose of study. The result shows that the moisture and temperature change do yielding the change of the warpage of the IC package. Chi-Hui Chien 錢志回 2000 學位論文 ; thesis 73 zh-TW |
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碩士 === 國立中山大學 === 機械工程學系研究所 === 88 === Abstract:
The main aim of this paper is to utilizing the Shadow Moirè method to study the moisture effect on the warpage of PBGA IC package under the IR-reflow process.
An environmental controlled box is designed and built. Three combinations of different moisture and temperature status are chosen for the purpose of study. The result shows that the moisture and temperature change do yielding the change of the warpage of the IC package.
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author2 |
Chi-Hui Chien |
author_facet |
Chi-Hui Chien Chien-Hsiung Hung 洪健雄 |
author |
Chien-Hsiung Hung 洪健雄 |
spellingShingle |
Chien-Hsiung Hung 洪健雄 The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process |
author_sort |
Chien-Hsiung Hung |
title |
The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process |
title_short |
The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process |
title_full |
The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process |
title_fullStr |
The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process |
title_full_unstemmed |
The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process |
title_sort |
study of the moisture effect on the warpage of ic packages in the ir-reflow process |
publishDate |
2000 |
url |
http://ndltd.ncl.edu.tw/handle/67751684491320976619 |
work_keys_str_mv |
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