The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process

碩士 === 國立中山大學 === 機械工程學系研究所 === 88 === Abstract： The main aim of this paper is to utilizing the Shadow Moirè method to study the moisture effect on the warpage of PBGA IC package under the IR-reflow process. An environmental controlled box is designed and built. Three combinations of different moist...

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Bibliographic Details
Main Authors:	Chien-Hsiung Hung, 洪健雄
Other Authors:	Chi-Hui Chien
Format:	Others
Language:	zh-TW
Published:	2000
Online Access:	http://ndltd.ncl.edu.tw/handle/67751684491320976619

id	ndltd-TW-088NSYS5490078
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spelling	ndltd-TW-088NSYS54900782016-07-08T04:22:58Z http://ndltd.ncl.edu.tw/handle/67751684491320976619 The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process 半導體構裝體於不同溫濕保存環境下經IR-reflow過程後翹曲現象之研究 Chien-Hsiung Hung 洪健雄碩士國立中山大學機械工程學系研究所 88 Abstract： The main aim of this paper is to utilizing the Shadow Moirè method to study the moisture effect on the warpage of PBGA IC package under the IR-reflow process. An environmental controlled box is designed and built. Three combinations of different moisture and temperature status are chosen for the purpose of study. The result shows that the moisture and temperature change do yielding the change of the warpage of the IC package. Chi-Hui Chien 錢志回 2000 學位論文 ; thesis 73 zh-TW
collection	NDLTD
language	zh-TW
format	Others
sources	NDLTD
description	碩士 === 國立中山大學 === 機械工程學系研究所 === 88 === Abstract： The main aim of this paper is to utilizing the Shadow Moirè method to study the moisture effect on the warpage of PBGA IC package under the IR-reflow process. An environmental controlled box is designed and built. Three combinations of different moisture and temperature status are chosen for the purpose of study. The result shows that the moisture and temperature change do yielding the change of the warpage of the IC package.
author2	Chi-Hui Chien
author_facet	Chi-Hui Chien Chien-Hsiung Hung 洪健雄
author	Chien-Hsiung Hung 洪健雄
spellingShingle	Chien-Hsiung Hung 洪健雄 The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process
author_sort	Chien-Hsiung Hung
title	The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process
title_short	The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process
title_full	The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process
title_fullStr	The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process
title_full_unstemmed	The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process
title_sort	study of the moisture effect on the warpage of ic packages in the ir-reflow process
publishDate	2000
url	http://ndltd.ncl.edu.tw/handle/67751684491320976619
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The Study of the Moisture Effect on the Warpage of IC Packages in the IR-Reflow Process

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