The Study of the Temperature Ramp-up Rate on the Warpage of IC Packages in the IR-reflow Process
碩士 === 國立中山大學 === 機械工程學系研究所 === 88 === The main aim of this study is to extending the holographic interferometry technique to measure the effect of the temperature ramp-up rate on the warpage of IC packages in the IR-reflow process . It is noted that both the warpage and the ambient temperature chan...
Main Authors: | , |
---|---|
Other Authors: | |
Format: | Others |
Language: | zh-TW |
Published: |
2000
|
Online Access: | http://ndltd.ncl.edu.tw/handle/06023236914875758794 |