Study of Semiconductor Processes Using Electroless Plating Method to Grow Copper Seed Layer
碩士 === 國立臺灣大學 === 化學研究所 === 88 === The emergence of copper manufacturing process has come about because of the existent bottleneck of the aluminum material used for the conducting wires on semiconductor chips. As the manufacturing processes reduce the component size in ICs to less than 0.25 mm, the...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/00237122034672308690 |