The Study Of Wire Saw Machining
博士 === 國立臺灣大學 === 機械工程學研究所 === 88 === The study of Wire Saw Machining Abstract Wire saw is a machining method that uses free abrasives to cut semiconductor, crystal, various single crystals, oxide semiconductor, magnetic material and other brittle materials. It increases the v...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/65449676420137525232 |