Thermal Stress Analysis and Optimization of Plastic Ball Grid Array Assembly
碩士 === 國立臺灣大學 === 機械工程學研究所 === 88 === A Plastic Ball Grid Array assembly(PBGA) is basically a composite structure consisting of different materials. Because each of these materials has different elastic modulus and coefficient of thermal expansion(CTE), thermal stresses are generated in the interfac...
| Main Authors: | , |
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| Other Authors: | |
| Format: | Others |
| Language: | zh-TW |
| Published: |
2000
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| Online Access: | http://ndltd.ncl.edu.tw/handle/01274666111343577613 |