| Summary: | 碩士 === 國立臺灣科技大學 === 纖維及高分子工程研究所 === 88 === The synthesis and thermal properties of addition polyamide-imides （PAI）adhesives which synthesized by Nadic anhydride（NA）、4-aminobenzoic acid、4,4’-ODA and NA、4-aminobenzoic acid、contain amide of diamine.
The structures of PAI were characterized by element analysis, Fourier transform infrared spectroscopy and x-ray diffraction. Thermal properties using differential scanning calorimeter and thermo gravimetric analyzer techniques. The adhesive properties of polyamide-imides/copper foil test by T-peel test, and the surface of was observed by scanning electron microscopy. The electric properties test on polyamide-imides/copper foil based electron shapes display good dielectric constant, low dissipation factor.
The polyamide-imides have chemical inertness, elevated temperature performance and good electric properties, that as a thermal adhesive.
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