| Summary: | 碩士 === 國立成功大學 === 機械工程學系 === 89 === Selection of suitable materials is important for successful engineering product. The mechanical properties of materials play a key role for material selection. As a result, material properties characterization is critical for engineering design. For certain concerns, such as high cycle fatigue and electronic packaging reliability, the desired material properties cannot be effectively tested by the existed testing systems; therefore, new testing systems are required.
This thesis presents the conceptual design for a novel material fatigue testing system for accelerating the mechanical fatigue test for electronic packaging. It utilizes piezoelectric actuator and adaptive control algorithm to provide high frequency fatigue cycle and to precisely control the loading or displacement. For mechanical stressing this system can provide same fatigue stress with much higher testing rate than the conventional thermal cycling tests.
Due to complicated thermal/mechanical/material coupling it is difficult to analyze the control mechanism in electronic packaging failure by the present methods. However, this system, in combined with a temperature control environment and a creep testing subsystem, can be used to decouple these failure mechanisms. By this approach, it is possible to quantify the significance and sensitivity for each failure control mechanisms in packaging reliability and to provide the scientific basis for developing methods to improve electronic packaging reliability.
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